System In Chip - Power Supply Technology

LPZs patent pending unique System in Package (SiP) product solutions allow product developers and manufacturer to take advantage of Semiconductor Power Supply in much smaller form factors and lower cost than traditional power supply designs. With the help of proven IC Packaging Technologies, LPZ has developed integrated power supply solutions in scales typically reserved for ICs only.

The LED technology is evolving with a fast pace and designing a power supply and control system is essential for sucess of the product. Keeping in mind the efficiency and form factor requirments LPZ modules allow highly efficient power solution with inbuit LED drives compatible with all type of LEDs. LED lighting are becoming commodity product and the product development cycles is coming under considerable pressure to reduce time to market and less technical and financial risk.

Typically, modules have been designed to incorporate the core functionality of a AC to AC convertor, AC to DC conversion, Solar Pannel integreation, Battery charging control, remote control solution, LED dimming solution and many other features. As a result, the developer usually finds themselves developing the actual power supply to integrate those functions normally omitted.

Designed using the industry's best in class silicon technologies, our products address the power supply market demand for smaller, cost effective and more effective solutions. LPZ's SiP products attack these issues head-on by delivering a complete radio solution in scales normally associated only with ceramic solutions. Our products deliver world-class functionality including all I/O, power management/regulation, LED drivers, front-end components and contol software package. All the developer needs to do is select the package and connect to AC power and LEDs

LPZ's SiP Technology also solves many of the typical manufacturing and supply chain issues normally associated with both board down and module solutions. Designed to support standard Surface Mount Technology (SMT) processes, our SiP products do not require special handling, reflow or rework processes. As a result, our customers no longer need to integrate connectors or develop and maintain unique manufacturing techniques to support a module design-in. And because our SiP solutions come in tape and reel pre-tested from the factory, our customers' test and QA burdens are minimized.

• LPZ-P08L08X-Soultions for Residiential Lights upto 16 LED
• LPZ-P08M16X-Soultions for High power LED upto 16 W.
• LPZ-P08S64X-Soultions for outside Light with LED upto 40 W.
• LPZ-P08Z16X-Soultions for multi channel  Street lights upto 160 W.